features fast recovery time. mpak package is suitable for high density surface mounting and high speed assembly. ordering information type no. laser mark package code HSM2836C a 4 mpak pin arrangement 1 cathode 2 cathode 3 anode (top view) 2 1 3 ade-208-030b(z) rev. 2 aug. 1995 HSM2836C silicon epitaxial planar diode for high speed switching absolute maximum ratings ** (ta = 25?) item symbol value unit peak reverse voltage v rm 85 v reverse voltage v r 80 v peak forward current i fm 300 ma non-repetitive peak forward surge current i fsm *4 a average forward current i o 100 ma junction temperature t j 125 ? storage temperature t stg -55 to +125 ? * within 1? forward surge current. ** per one device electrical characteristics * (ta = 25?) item symbol min typ max unit test condition v f1 0.72 1.0 i f = 10 ma forward voltage v f2 0.83 1.0 v i f = 50 ma v f3 0.90 1.2 i f = 100 ma reverse current i r 0.1 ? v r = 80 v capacitance c 2.5 4.0 pf v r = 0 v, f = 1 mhz reverse recovery time trr 20 ns i f = 10ma, v r =6v, r l =50 ? * per one device
forward voltage v (v) f forward current i (a) f 10 -6 10 -1 0 0.2 0.4 0.6 0.8 1.0 10 -3 ta=-25? ta=25 ? 10 -5 10 -4 10 -2 ta=75 ? reverse voltage v (v) r reverse current i (a) r 10 -9 10 -7 02040 60 80 100 10 -8 10 -6 10 -10 10 -5 10 -4 10 -11 ta=50? ta=75? ta=25? ta= 0 ? ta=-25? reverse voltage v (v) r 1.0 10 2 10 1.0 10 capacitance c (pf) -1 10 f=1mhz fig.1 forward current vs. forward voltage fig.2 reverse current vs. reverse voltage fig.3 capacitance vs. reverse voltage HSM2836C
package dimensions unit: mm 0.16 0 ?0.10 + 0.10 ?0.06 0.4 + 0.10 ?0.05 0.95 0.95 1.9 2.8 + 0.3 ?0.1 2.8 + 0.2 ?0.6 0.65 + 0.1 ?0.3 1.5 0.65 + 0.1 ?0.3 1.1 + 0.2 ?0.1 0.3 a 4 laser mark 21 3 1 cathode 2 cathode 3 anode hitachi code mpak(1) jedec code eiaj code sc-59a weight (g) 0.011 HSM2836C
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